Lau J. Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology 2024
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Lau J. Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology 2024
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Category: Other
Total size: 32.05 MB
Added: 7 months ago (2025-03-10 23:38:58)
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Info Hash: 12E72655D6A81ADD611170F0A1790C1DD772FEC9
Last updated: 4 hours ago (2025-11-09 00:02:38)
Description:
Textbook in PDF format
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.
The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc